GS Polymers, Inc. Adhesive GSP 1339-1

Description
Description

Suppliers

Company
Product
Description
Supplier Links
Brea, CA, USA
Adhesive
GSP 1339-1
Adhesive GSP 1339-1
Supplier's Site

Technical Specifications

  GS Polymers, Inc.
Product Category Industrial Adhesives
Product Number GSP 1339-1
Product Name Adhesive
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Composition Unfilled
Unlock Full Specs
to access all available technical data

Similar Products

Double-component thermal conductive sealant gel for heat transfer - SE300AB - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Type / Form Gel
Features Thermally Conductive
View Details
High-Reliability Thermoset Adhesives for Semiconductor Packaging - STAYCHIP ® F614-3A - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoset
Features High Dielectric; Electrically Conductive
Industry Electronics; Semiconductors, IC's
View Details
Ellsworth E-CAST 207-1 Epoxy Adhesive Light Gray 50 mL Cartridge - E-CAST 207-1 50ML CARTRDGE - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Substrate Compatibility Metal; Paper or Paperboard; Plastic
View Details
ELANTAS PDG ELAN-Tron® E 203 Epoxy Resin Black 1 pt Can - E 203 BLACK PINT DP - Ellsworth Adhesives
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Features Sealant
View Details