GC Electronics Heat Sink Compound 1 Lb. Jar Gc Electronics 10-8135-0001

Description
HEAT SINK COMPOUND 1 LB. JAR
Description
HEAT SINK COMPOUND 1 LB. JAR

Suppliers

Company
Product
Description
Supplier Links
Heat Sink Compound 1 Lb. Jar Gc Electronics - 79C4252 - Newark, An Avnet Company
Chicago, IL, United States
Heat Sink Compound 1 Lb. Jar Gc Electronics
79C4252
Heat Sink Compound 1 Lb. Jar Gc Electronics 79C4252
HEAT SINK COMPOUND 1 LB. JAR

HEAT SINK COMPOUND 1 LB. JAR

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Industrial Adhesives
Product Number 79C4252
Product Name Heat Sink Compound 1 Lb. Jar Gc Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Fluon® Perfluoro Adhesive - EA-2000 - AGC Chemicals Americas, Inc.
AGC Chemicals Americas, Inc.
Specs
Chemical System PFA
Type / Form Pellets
Features Laminaes
View Details
Dymax Ultra Light-Weld® 4-20418 UV Curing Adhesive Clear 1 L Bottle - 4-20418 1 LITER BOTTLE - Ellsworth Adhesives
Specs
Cure / Technology Single Component
Features Laminaes
Substrate Compatibility Metal; Plastic
View Details
UV-Curing Epoxy, NOA 86, 6 gm Syringe - NOA-86S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details