GC Electronics Heat Sink Compound 1 Lb. Jar Gc Electronics 10-8135-0001

Name: Heat Sink Compound 1 Lb. Jar Gc Electronics
Brand: GC Electronics

Description

HEAT SINK COMPOUND 1 LB. JAR

Description

HEAT SINK COMPOUND 1 LB. JAR

Suppliers

Company

Product

Description

Supplier Links

Chicago, IL, United States

Heat Sink Compound 1 Lb. Jar Gc Electronics
79C4252

Heat Sink Compound 1 Lb. Jar Gc Electronics 79C4252

HEAT SINK COMPOUND 1 LB. JAR

Supplier's Site

	Newark, An Avnet Company
Product Category	Industrial Adhesives
Product Number	79C4252
Product Name	Heat Sink Compound 1 Lb. Jar Gc Electronics

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TE Connectivity

Beijing Grish Hitech Co., Ltd.

Specs

Cure / Technology Thermoset; Two Component

Chemical System Epoxy

Type / Form Liquid

Dexmet® Corporation, a part of PPG’s engineered materials division

Specs

Cure / Technology Two Component

Chemical System Epoxy; Silicone

Newport MKS

Specs

Cure / Technology UV or Radiation Cured

Chemical System Epoxy