GC Electronics Gc Bond, 2 Oz. Bottle Gc Electronics 10-4302-A

Description
GC BOND, 2 OZ. BOTTLE
  • Gc Bond, 2 Oz. Bottle Gc Electronics - 72W1306 - Newark, An Avnet Company
    Newark, An Avnet Company
Description
GC BOND, 2 OZ. BOTTLE

Suppliers

Company
Product
Description
Supplier Links
Gc Bond, 2 Oz. Bottle Gc Electronics - 72W1306 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Gc Bond, 2 Oz. Bottle Gc Electronics
72W1306
Gc Bond, 2 Oz. Bottle Gc Electronics 72W1306
GC BOND, 2 OZ. BOTTLE

GC BOND, 2 OZ. BOTTLE

Supplier's Site

Technical Specifications

  Newark, An Avnet Company
Product Category Industrial Adhesives
Product Number 72W1306
Product Name Gc Bond, 2 Oz. Bottle Gc Electronics
Unlock Full Specs
to access all available technical data

Similar Products

Epoxy Adhesives - 583393-000 - TE Connectivity
TE Connectivity
Epoxy Adhesives
583393-000
View Details
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices - CSF30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices
CSF30
Specs
Features Thermally Conductive
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Dymax EMAX 99004 Dual Cure Encapsulant Light Yellow 300 mL Cartridge - E-MAX 99004 300ML CARTRIDGE - Ellsworth Adhesives
Dymax
Dymax EMAX 99004 Dual Cure Encapsulant Light Yellow 300 mL Cartridge
E-MAX 99004 300ML CARTRIDGE
Specs
Cure / Technology Single Component
Features Encapsulant, Potting Compound
Viscosity 15000 cP
View Details
Copper Adhesion Promoters for IC Substrates - MultiPrep 200 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Copper Adhesion Promoters for IC Substrates
MultiPrep 200
Specs
Type / Form Sheet or Film; Liquid
Substrate Compatibility Metal; Copper adhesion promotion
Industry Electronics; Semiconductors, IC's
View Details