GaN Systems Inc. GaN Power Transistor GS66508P-MR

Description
The GS66508P is an enhancement mode GaN-on-silicon power transistor. The properties of GaN allow for high current, high voltage breakdown and high switching frequency. GaN Systems implements patented Island Technology cell layout for high-current die performance & yield. GaNPX packaging enables low inductance and low thermal resistance in a small package. The GS66508P is a bottom-side cooled transistor that offers very low junction-to-case thermal resistance for demanding high power applications. These features combine to provide very high efficiency power switching.
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Description
The GS66508P is an enhancement mode GaN-on-silicon power transistor. The properties of GaN allow for high current, high voltage breakdown and high switching frequency. GaN Systems implements patented Island Technology cell layout for high-current die performance & yield. GaNPX packaging enables low inductance and low thermal resistance in a small package. The GS66508P is a bottom-side cooled transistor that offers very low junction-to-case thermal resistance for demanding high power applications. These features combine to provide very high efficiency power switching.
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Suppliers

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GaN Power Transistor - GS66508P-MR - Richardson RFPD
Downers Grove, IL, United States
GaN Power Transistor
GS66508P-MR
GaN Power Transistor GS66508P-MR
The GS66508P is an enhancement mode GaN-on-silicon power transistor. The properties of GaN allow for high current, high voltage breakdown and high switching frequency. GaN Systems implements patented Island Technology cell layout for high-current die performance & yield. GaNPX packaging enables low inductance and low thermal resistance in a small package. The GS66508P is a bottom-side cooled transistor that offers very low junction-to-case thermal resistance for demanding high power applications. These features combine to provide very high efficiency power switching.

The GS66508P is an enhancement mode GaN-on-silicon power transistor. The properties of GaN allow for high current, high voltage breakdown and high switching frequency. GaN Systems implements patented Island Technology cell layout for high-current die performance & yield. GaNPX packaging enables low inductance and low thermal resistance in a small package. The GS66508P is a bottom-side cooled transistor that offers very low junction-to-case thermal resistance for demanding high power applications. These features combine to provide very high efficiency power switching.

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Technical Specifications

  Richardson RFPD
Product Category Transistors
Product Number GS66508P-MR
Product Name GaN Power Transistor
Transistor Technology / Material GaN
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