Fosroc Limited Adhesive Used for Bonding Expoband Plus,Expoband H45 and Synkoflex FR Supastik E10

Description
Adhesive used for bonding Expoband Plus,Expoband H45 and Synkoflex FR(please refer to appropriate data sheet)
Description
Adhesive used for bonding Expoband Plus,Expoband H45 and Synkoflex FR(please refer to appropriate data sheet)

Suppliers

Company
Product
Description
Supplier Links
Adhesive Used for Bonding Expoband Plus,Expoband H45 and Synkoflex FR - Supastik E10 - Fosroc Limited
Tamworth, United Kingdom
Adhesive Used for Bonding Expoband Plus,Expoband H45 and Synkoflex FR
Supastik E10
Adhesive Used for Bonding Expoband Plus,Expoband H45 and Synkoflex FR Supastik E10
Adhesive used for bonding Expoband Plus,Expoband H45 and Synkoflex FR(please refer to appropriate data sheet)

Adhesive used for bonding Expoband Plus,Expoband H45 and Synkoflex FR(please refer to appropriate data sheet)

Supplier's Site

Technical Specifications

  Fosroc Limited
Product Category Industrial Adhesives
Product Number Supastik E10
Product Name Adhesive Used for Bonding Expoband Plus,Expoband H45 and Synkoflex FR
Unlock Full Specs
to access all available technical data

Similar Products

Adhesives -  - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Cure / Technology Two Component  
Chemical System Epoxy; Silicone
View Details
UV-Curing Epoxy, NOA 85, 6 gm Syringe - NOA-85S - Newport MKS
Specs
Cure / Technology UV or Radiation Cured
Chemical System Epoxy
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 482 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Type / Form Sheet or Film
Industry Electronics; Semiconductors, IC's
View Details
1-Part, General Purpose, RTV Silicone Adhesive Sealant - AS1821 - CHT USA Inc.
Specs
Cure / Technology Single Component; Acetone
Chemical System Silicone
Features Sealant
View Details