Fischer Electronik Gap Filler, Gel Foil, 1.5 W/m K, 1Mm; Insulator Body Material Fischer Elektronik GEL10

Description
GAP FILLER, GEL FOIL, 1.5 W/M K, 1MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes
  • Gap Filler, Gel Foil, 1.5 W/m K, 1Mm; Insulator Body Material Fischer Elektronik - 65W5608 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
GAP FILLER, GEL FOIL, 1.5 W/M K, 1MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Gap Filler, Gel Foil, 1.5 W/m K, 1Mm; Insulator Body Material Fischer Elektronik - 65W5608 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Gap Filler, Gel Foil, 1.5 W/m K, 1Mm; Insulator Body Material Fischer Elektronik
65W5608
Gap Filler, Gel Foil, 1.5 W/m K, 1Mm; Insulator Body Material Fischer Elektronik 65W5608
GAP FILLER, GEL FOIL, 1.5 W/M K, 1MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m. K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes

GAP FILLER, GEL FOIL, 1.5 W/M K, 1MM; Insulator Body Material:Silicone Foil; Thermal Conductivity:1.5W/m.K; Breakdown Voltage Vbr:-; Thickness:1mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:14kV/mm; Product RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 65W5608
Product Name Gap Filler, Gel Foil, 1.5 W/m K, 1Mm; Insulator Body Material Fischer Elektronik
Thermal Conductivity 1.5 W/m-K (0.8667 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed
SE3000
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details
Highly Thermally Conductive and Non-Flammable Interface Material - SARCON ® XR-Pe - Fujipoly® America Corp.
Fujipoly® America Corp.
Highly Thermally Conductive and Non-Flammable Interface Material
SARCON ® XR-Pe
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.0787 inch (1 to 2 mm)
View Details
Thermally Conductive, Low Outgassing Epoxy - EP30AN-1 - Master Bond, Inc.
Master Bond, Inc.
Thermally Conductive, Low Outgassing Epoxy
EP30AN-1
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details