Extreme Engineering Solutions, Inc. (X-ES) XMC/PMC I/O Breakout Module XIt2013

The XIt2013 is a XIM/PIM module that breaks out P14 and P16 I/O to a general-purpose high-density 100-pin micro-D connector for easy connectivity to other devices. It is intended to mate with a Rear Transition Module (RTM), which routes the XMC/PMC rear I/O from the VPX interface in accordance with ANSI/VITA 46.9 to a XIM site. The differential X12d and X8d signals are impedance-controlled and length-matched, within each group, from an XMC connector. These create an ideal way to break out high-speed interfaces from an XMC mezzanine card, such as a video interface from a graphics card. The single-ended X38s signals are also impedance-controlled and length-matched from an XMC connector, which allows connectivity from X38s or X24s. Alternatively, a subset of P64s I/O (based on RTM support) is available. Features XIM/PIM module High-density, rugged Glenair 100-pin connector, part number MWDM2L-100SCBR-.110 Routes length-matched X12d I/O from P16 Routes length-matched X8d I/O from P16 Routes length-matched X38s from P16 or P14 (subset of P64s I/O) Compatible with many X-ES Rear Transition Modules (RTMs) Technical Specs I/O Support High-density, rugged Glenair 100-pin connector Routes length-matched X12d I/O from P16 Routes length-matched X8d I/O from P16 Routes length-matched X38s from P16 or P14 (subset of P64s I/O) I/O signal pinout mapping table available upon request, contact factory Physical Characteristics XMC/PMC I/O module (XIM/PIM) Dimensions: 74 mm x 69 mm Environmental Requirements Contact factory for appropriate board configuration based on environmental requirements. Supported ruggedization levels (see the X-ES Ruggedization Chart): 1 Conformal coating available as an ordering option