Essentra Components Transistor Case Insulator Pad, To-218; Insulator Body Material Essentra Components TO-218-70

Description
TRANSISTOR CASE INSULATOR PAD, TO-218; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.178mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
  • Transistor Case Insulator Pad, To-218; Insulator Body Material Essentra Components - 34M8832 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
TRANSISTOR CASE INSULATOR PAD, TO-218; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.178mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Transistor Case Insulator Pad, To-218; Insulator Body Material Essentra Components - 34M8832 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Transistor Case Insulator Pad, To-218; Insulator Body Material Essentra Components
34M8832
Transistor Case Insulator Pad, To-218; Insulator Body Material Essentra Components 34M8832
TRANSISTOR CASE INSULATOR PAD, TO-218; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.178mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

TRANSISTOR CASE INSULATOR PAD, TO-218; Insulator Body Material:Fibreglass, Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.178mm; Volume Resistivity:-; Thermal Impedance:-; Dielectric Strength:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 34M8832
Product Name Transistor Case Insulator Pad, To-218; Insulator Body Material Essentra Components
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-99 - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
T-99
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 2200 F (0 to 1204 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - Dissipator 745
745PT
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermal gel for cpu - SE40 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal gel for cpu
SE40
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details