Ensinger, Inc. TECASINT 2011 brown

Description
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS-Q-70-20. Facts Chemical designation: PI (Polyimide) Color: brown Density: 1,38 g/cm3 Main Features very good thermal stability high thermal and mechanical capacity low outgassing very good electrical insulation resistance against high energy radiation good chemical resistance high creep resistance sensitive to hydrolysis in higher thermal range Target industries aircraft and aerospace technology semiconductor technology precision engineering electrical engineering medical technology electronics
Datasheet
Description
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS-Q-70-20. Facts Chemical designation: PI (Polyimide) Color: brown Density: 1,38 g/cm3 Main Features very good thermal stability high thermal and mechanical capacity low outgassing very good electrical insulation resistance against high energy radiation good chemical resistance high creep resistance sensitive to hydrolysis in higher thermal range Target industries aircraft and aerospace technology semiconductor technology precision engineering electrical engineering medical technology electronics
Datasheet

Suppliers

Company
Product
Description
Supplier Links
TECASINT 2011 brown -  - Ensinger, Inc.
Washington, PA, United States
TECASINT 2011 brown
TECASINT 2011 brown
TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS-Q-70-20. Facts Chemical designation: PI (Polyimide) Color: brown Density: 1,38 g/cm3 Main Features very good thermal stability high thermal and mechanical capacity low outgassing very good electrical insulation resistance against high energy radiation good chemical resistance high creep resistance sensitive to hydrolysis in higher thermal range Target industries aircraft and aerospace technology semiconductor technology precision engineering electrical engineering medical technology electronics

TECASINT 2011 is one of the unfilled natural grades. It has a very high modulus of elasticity, high rigidity and hardness. Compared with TECASINT 1011 it has significantly reduced moisture absorption, higher toughness and better machining properties. Within the TECASINT 2000 series the material has the maximum strength and elongation, together with a high modulus of elasticity and minimal thermal and electrical conductivity. TECASINT 2011 is highly pure with low outgassing in accordance with ESA regulation ECSS-Q-70-20.

Facts

  • Chemical designation: PI (Polyimide)
  • Color: brown
  • Density: 1,38 g/cm3

Main Features

  • very good thermal stability
  • high thermal and mechanical capacity
  • low outgassing
  • very good electrical insulation
  • resistance against high energy radiation
  • good chemical resistance
  • high creep resistance
  • sensitive to hydrolysis in higher thermal range

Target industries

  • aircraft and aerospace technology
  • semiconductor technology
  • precision engineering
  • electrical engineering
  • medical technology
  • electronics
Supplier's Site Datasheet

Technical Specifications

  Ensinger, Inc.
Product Category Fabricated Plastic Parts and Semi-Finished Shapes
Product Name TECASINT 2011 brown
Chemical System PI (Polyimide); Polyimide or Bismaleimide (BMI)
Filler Unfilled
Use Temperature 536 to 626 F (280 to 330 C)
Deflection Temperature 600 F (316 C)
Thermal Conductivity 0.2207 W/m-K (0.1275 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Fence Privacy - American Flag Kit -  - Pexco
Specs
Form / Shape Bar Stock or Rod Stock
Industry Repair or Construction; OEM or Industrial
View Details
ptfe container -  - Jinshiling (Heyuan) Technology Co., Ltd.
Jinshiling (Heyuan) Technology Co., Ltd.
Specs
Chemical System Fluoropolymer
Industry Sanitary; Chemical, laboratory, food industry
View Details
PEEK structural parts -  - Fountyl Technologies Pte. Ltd.
Fountyl Technologies Pte. Ltd.
Specs
Chemical System PEEK
Industry Aerospace; Automotive; Electronics; Sanitary; Military; OEM or Industrial
View Details
Rubber Sheets - 205465 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Shape Sheet or Film
Chemical System Silicone; Silicone
Thickness 0.0020 inch (0.0500 mm)
View Details