Emerson Bearing Co. Solution 30 Pipe Sealant with Teflon® (250ml) 40302

Description
PIPE SEALANT WITH TEFLON - Low strength, non-migrating paste seals instantly, Forms seal for fluid and gas pressurized pipe fittings. Intended for use on tapered threads. May be disassembled with hand tools. Temperature resistant to 400° F and rated to 10,000 psi.
Description
PIPE SEALANT WITH TEFLON - Low strength, non-migrating paste seals instantly, Forms seal for fluid and gas pressurized pipe fittings. Intended for use on tapered threads. May be disassembled with hand tools. Temperature resistant to 400° F and rated to 10,000 psi.

Suppliers

Company
Product
Description
Supplier Links
Solution 30 Pipe Sealant with Teflon® (250ml) - 40302 - Emerson Bearing Co.
Boston, MA, USA
Solution 30 Pipe Sealant with Teflon® (250ml)
40302
Solution 30 Pipe Sealant with Teflon® (250ml) 40302
PIPE SEALANT WITH TEFLON - Low strength, non-migrating paste seals instantly, Forms seal for fluid and gas pressurized pipe fittings. Intended for use on tapered threads. May be disassembled with hand tools. Temperature resistant to 400° F and rated to 10,000 psi.

PIPE SEALANT WITH TEFLON - Low strength, non-migrating paste seals instantly, Forms seal for fluid and gas pressurized pipe fittings. Intended for use on tapered threads. May be disassembled with hand tools. Temperature resistant to 400° F and rated to 10,000 psi.

Supplier's Site

Technical Specifications

  Emerson Bearing Co.
Product Category Industrial Sealants
Product Number 40302
Product Name Solution 30 Pipe Sealant with Teflon® (250ml)
Viscosity 350000 cP
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Type / Form Liquid; Sheet or Film
Features EMI/RFI Shielding; Gap Filler, Foam in Place Gasket; Thermally Conductive
Industry Electronics; Semiconductors, IC's
View Details
ELANTAS PDG CONAPOXY AD-10 Epoxy Encapsulant Brown 1 qt Can - AD-10 QT - Ellsworth Adhesives
Specs
Substrate Compatibility Ceramic, Glass; Metal; Plastic
Chemical System Epoxy
Features Encapsulant, Potting Compound
View Details
KM 2740 Series -  - Beacon Adhesives, Inc.
Beacon Adhesives, Inc.
View Details
Liquid Gap Fillers for Electronics - Electrolube ® LGF400 Liquid Gap Filler - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Type / Form Liquid
Features Leveling Filling; Gap Filler, Foam in Place Gasket; Thermally Conductive
View Details