ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. Part A, 5 gal Pail.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | EP1121 CLEAR - A PL |
| Product Name | ResinLab EP1121 Epoxy Encapsulant Part A Clear 5 gal Pail |
| Cure / Technology | Two Component |
| Chemical System | Epoxy |
| Thermal Conductivity | 0.1000 W/m-K (0.0578 BTU-ft/hr-ft²-F) |
| Tensile (Break) | 1500 psi (10342 KPa) |
