Resinlab ResinLab EP1121 Epoxy Encapsulant Clear 400 mL Cartridge EP1121 CLEAR 400ML

Description
ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 400 mL Cartridge.
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Description
ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 400 mL Cartridge.
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Suppliers

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Product
Description
Supplier Links
ResinLab EP1121 Epoxy Encapsulant Clear 400 mL Cartridge - EP1121 CLEAR 400ML - Ellsworth Adhesives
Germantown, WI, USA
ResinLab EP1121 Epoxy Encapsulant Clear 400 mL Cartridge
EP1121 CLEAR 400ML
ResinLab EP1121 Epoxy Encapsulant Clear 400 mL Cartridge EP1121 CLEAR 400ML
ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 400 mL Cartridge.

ResinLab EP1121 Clear is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 400 mL Cartridge.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Encapsulants and Potting Compounds
Product Number EP1121 CLEAR 400ML
Product Name ResinLab EP1121 Epoxy Encapsulant Clear 400 mL Cartridge
Cure / Technology Two Component  
Chemical System Epoxy
Thermal Conductivity 0.1000 W/m-K (0.0578 BTU-ft/hr-ft²-F)
Tensile (Break) 1500 psi (10342 KPa)
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