Resinlab ResinLab EP1121 Epoxy Encapsulant Black 50 mL Cartridge EP1121 BLACK 50ML

Description
ResinLab EP1121 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 50 mL Cartridge.
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Description
ResinLab EP1121 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 50 mL Cartridge.
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Suppliers

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Product
Description
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ResinLab EP1121 Epoxy Encapsulant Black 50 mL Cartridge - EP1121 BLACK 50ML - Ellsworth Adhesives
Germantown, WI, USA
ResinLab EP1121 Epoxy Encapsulant Black 50 mL Cartridge
EP1121 BLACK 50ML
ResinLab EP1121 Epoxy Encapsulant Black 50 mL Cartridge EP1121 BLACK 50ML
ResinLab EP1121 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 50 mL Cartridge.

ResinLab EP1121 Black is a two component, room temperature curing, unfilled epoxy encapsulant that is used for medium to large castings and penetrating circuitry. It has flexibility, low viscosity, good wicking, good air release, excellent thermal shock and cycling properties. It is resistant to most organic solvents and water. 50 mL Cartridge.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Encapsulants and Potting Compounds
Product Number EP1121 BLACK 50ML
Product Name ResinLab EP1121 Epoxy Encapsulant Black 50 mL Cartridge
Cure / Technology Two Component  
Chemical System Epoxy
Thermal Conductivity 0.1000 W/m-K (0.0578 BTU-ft/hr-ft²-F)
Tensile (Break) 1500 psi (10342 KPa)
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