Features:
High temperature metallurgically bonded construction
Glass passivated chip junction
Superfast recovery times for high efficiency
Low forward voltage, high current capability
Low thermal resistance
Low power loss
Elite Semiconductor Products, Inc.
Done
Description
Features:
High temperature metallurgically bonded construction
Glass passivated chip junction
Superfast recovery times for high efficiency
Low forward voltage, high current capability
Low thermal resistance
Low power loss
Features:
High temperature metallurgically bonded construction
Glass passivated chip junction
Superfast recovery times for high efficiency
Low forward voltage, high current capability
Low thermal resistance
Low power loss
Features:
High temperature metallurgically bonded construction
