Features:
Glass PAssivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Ideal for Printed Circuit Boards
Elite Semiconductor Products, Inc.
Done
Description
Features:
Glass PAssivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Ideal for Printed Circuit Boards
Features:
Glass PAssivated Die Construction
Low Forward Voltage Drop
High Current Capability
High Reliability
High Surge Current Capability
Ideal for Printed Circuit Boards