Features:
Glass Passivated Die Construction
High Case Dielectric Strength of 1500 VRMS
Low Reverse Leakage Current
Surge overload Rating to 175A Peak
Ideal for Printed Circuit Board Applications
Lead Free Finish, RoHS Compliant
Elite Semiconductor Products, Inc.
Done
Description
Features:
Glass Passivated Die Construction
High Case Dielectric Strength of 1500 VRMS
Low Reverse Leakage Current
Surge overload Rating to 175A Peak
Ideal for Printed Circuit Board Applications
Lead Free Finish, RoHS Compliant
Features:
Glass Passivated Die Construction
High Case Dielectric Strength of 1500 VRMS
Low Reverse Leakage Current
Surge overload Rating to 175A Peak
Ideal for Printed Circuit Board Applications
Lead Free Finish, RoHS Compliant