Features:
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
Integrally molded heatsink provides very low thermal resistance for maximum heat dissipation
Universal 3-way terminals; snap-on, wire wrap-around, or P.C.B. mounting
Glass passivated chip junctions
High forward surge current capability
Typical IR less than 0.3 uA
Elite Semiconductor Products, Inc.
Done
Description
Features:
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
Integrally molded heatsink provides very low thermal resistance for maximum heat dissipation
Universal 3-way terminals; snap-on, wire wrap-around, or P.C.B. mounting
Glass passivated chip junctions
High forward surge current capability
Typical IR less than 0.3 uA
Features:
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
Integrally molded heatsink provides very low thermal resistance for maximum heat dissipation
Universal 3-way terminals; snap-on, wire wrap-around, or P.C.B. mounting
Glass passivated chip junctions
High forward surge current capability
Typical IR less than 0.3 uA
Features:
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
Integrally molded heatsink provides very low thermal resistance for maximum heat dissipation
Universal 3-way terminals; snap-on, wire wrap-around, or P.C.B. mounting
