FEATURES
High temperature metallurgically bonded construction
Hermetically sealed case
Glass passivated cavity-free junction
0.1Ampere operation at TA=55°C with no thermal runaway
Typically less than 0.1uA
Capable of meeting environmental standards of MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3I
Elite Semiconductor Products, Inc.
Done
Description
FEATURES
High temperature metallurgically bonded construction
Hermetically sealed case
Glass passivated cavity-free junction
0.1Ampere operation at TA=55°C with no thermal runaway
Typically less than 0.1uA
Capable of meeting environmental standards of MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3I
FEATURES
High temperature metallurgically bonded construction
Hermetically sealed case
Glass passivated cavity-free junction
0.1Ampere operation at TA=55°C with no thermal runaway
Typically less than 0.1uA
Capable of meeting environmental standards of MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed: 350°C/10 seconds, 0.375" (9.5mm) lead length, 5 lbs. (2.3I
FEATURES
High temperature metallurgically bonded construction
Hermetically sealed case
Glass passivated cavity-free junction
0.1Ampere operation
at TA=55°C with no
thermal runaway
Typically less than 0.1uA
Capable of meeting environmental standards of
MIL-S-19500
Fast switching for high efficiency
High temperature soldering guaranteed:
350°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3I<g)tension
