Electrolube Heat Transfer Paste, 50Ml, Tube; Dispensing Method Electrolube HTSP50T

Description
HEAT TRANSFER PASTE, 50ML, TUBE; Dispensing Method:Tube; Volume:50ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
HEAT TRANSFER PASTE, 50ML, TUBE; Dispensing Method:Tube; Volume:50ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Paste, 50Ml, Tube; Dispensing Method Electrolube - 44AC2395 - Newark, An Avnet Company
Chicago, IL, United States
Heat Transfer Paste, 50Ml, Tube; Dispensing Method Electrolube
44AC2395
Heat Transfer Paste, 50Ml, Tube; Dispensing Method Electrolube 44AC2395
HEAT TRANSFER PASTE, 50ML, TUBE; Dispensing Method:Tube; Volume:50ml; Weight:-; Product Range:- RoHS Compliant: Yes

HEAT TRANSFER PASTE, 50ML, TUBE; Dispensing Method:Tube; Volume:50ml; Weight:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 44AC2395
Product Name Heat Transfer Paste, 50Ml, Tube; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - NH Nonhardening - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 410 F (0 to 210 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Phase change insulation for communications equipment wireless stations - SP205A-AL -40 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Thermal Conductivity 4 W/m-K (2.31 BTU-ft/hr-ft²-F)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details