Electrolube Heat Transfer Comp Plus, Cartridge, 700G; Dispensing Method Electrolube HTCP700G

Description
HEAT TRANSFER COMP PLUS, CARTRIDGE, 700G; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:- RoHS Compliant: Yes
  • Heat Transfer Comp Plus, Cartridge, 700G; Dispensing Method Electrolube - 49AH7288 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
HEAT TRANSFER COMP PLUS, CARTRIDGE, 700G; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Comp Plus, Cartridge, 700G; Dispensing Method Electrolube - 49AH7288 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Heat Transfer Comp Plus, Cartridge, 700G; Dispensing Method Electrolube
49AH7288
Heat Transfer Comp Plus, Cartridge, 700G; Dispensing Method Electrolube 49AH7288
HEAT TRANSFER COMP PLUS, CARTRIDGE, 700G; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:- RoHS Compliant: Yes

HEAT TRANSFER COMP PLUS, CARTRIDGE, 700G; Dispensing Method:Cartridge; Volume:-; Weight:700g; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 49AH7288
Product Name Heat Transfer Comp Plus, Cartridge, 700G; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Silicone Free Form-in-Place Thermal Gap Filler - SARCON® SPG-25B-NS - Fujipoly® America Corp.
Fujipoly® America Corp.
Silicone Free Form-in-Place Thermal Gap Filler
SARCON® SPG-25B-NS
Specs
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Industry Electronics
Use Temperature -40 to 248 F (-40 to 120 C)
View Details
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D - 746D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Chemistries - Thermally Conductive Adhesives - DISSIPATOR 746D
746D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Chemical System Silicone
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High efficiency thermal pad for chipset - SF700 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High efficiency thermal pad for chipset
SF700
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 302 F (-50 to 150 C)
View Details
Underfill Materials for Printed Circuit Boards (PCBs) - ALPHA ® HiTech ® CU31-3300 - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Underfill Materials for Printed Circuit Boards (PCBs)
ALPHA ® HiTech ® CU31-3300
Specs
Industry Electronics; Semiconductors, IC's
Elongation 10.1 %
Dielectric Strength 635 kV/in (250 kV/cm)
View Details