MacDermid Alpha Electronics Solutions Advanced Hybrid Sintering Die Attach Solutions ATROX ® CD 590-HT2

Product Overview ATROX CD 590-HT2 is a thermosetting electrically conductive die attach designed for substrate based as well as metal lead frame semiconductor packages. This solution combines high thermal conductivity with excellent electrical performance to provide a high reliability die attach solution with broad die size and multipackage capability. Product Features High Thermal Conductivity At 10 W/mK bulk thermal conductivity, CD 590-HT2 offers a high-performance solution to meet requirements of higher functionality legacy packages like Quad Flat No-Lead package (QFN), Quad Flat Package (QFP) Robust Process Stability Broad process window with long open time and staging time to provide a production ready material Regulatory Compliance Zero Per- and Polyfluoroalkyl Substances (PFAS) die attach to meet industry’s demand for PFAS-free solutions to replace existing products with PFAS Proven Reliability Engineered for stability in Moisture Sensitivity Level (MSL) and thermal cycling tests, ensuring consistent electrical and thermal performance across operating conditions. Broad Package Compatibility Supports die attach for both metallized and bare silicon dies without die size limitation, providing flexibility across multiple semiconductor package types. Optimized Cure Profile Cures with a controlled ramp-soak profile at 125–175 °C, with options up to 200 °C for enhanced adhesion, minimizing thermal stress while allowing process flexibility. Featured Applications Power Module Assembly Ideal for attaching dies in power modules, including both metallized and bare silicon, where high thermal conductivity and long-term reliability are essential. Automotive & EV Electronics Supports critical attach requirements in underhood and electric vehicle systems such as traction inverters, DC/DC converters, and onboard chargers. Industrial & High-Reliability Systems Well-suited for ruggedized industrial controls, aerospace, and medical electronics that demand stable performance under thermal cycling and extended operating conditions.