Electrolube Heat Transfer Comp Plus, Syringe, 35Ml; Dispensing Method Electrolube HTCP35SL

Description
HEAT TRANSFER COMP PLUS, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet
Description
HEAT TRANSFER COMP PLUS, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Heat Transfer Comp Plus, Syringe, 35Ml; Dispensing Method Electrolube - 49AH7287 - Newark, An Avnet Company
Chicago, IL, United States
Heat Transfer Comp Plus, Syringe, 35Ml; Dispensing Method Electrolube
49AH7287
Heat Transfer Comp Plus, Syringe, 35Ml; Dispensing Method Electrolube 49AH7287
HEAT TRANSFER COMP PLUS, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes

HEAT TRANSFER COMP PLUS, SYRINGE, 35ML; Dispensing Method:Syringe; Volume:35ml; Weight:-; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 49AH7287
Product Name Heat Transfer Comp Plus, Syringe, 35Ml; Dispensing Method Electrolube
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
STAYSTIK ® 472 -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Industry Electronics; Semiconductors, IC's
View Details
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation - EP29LPTCHT - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Gap Filler, Foam in Place Gasket
View Details