Allied Electronics, Inc. WS482 3% WATER SOLUABLE CORE SOLDER, SN100C, .032 70054283

Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering
Description
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

Suppliers

Company
Product
Description
Supplier Links
WS482 3% WATER SOLUABLE CORE SOLDER, SN100C, .032 - 70054283 - Allied Electronics, Inc.
Fort Worth, TX, USA
WS482 3% WATER SOLUABLE CORE SOLDER, SN100C, .032
70054283
WS482 3% WATER SOLUABLE CORE SOLDER, SN100C, .032 70054283
The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features: Does Not Contain Silver or Bismuth Eutectic Alloy Bridge-Free and Icicle-Free Soldering Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate Good Through-Hole Penetration Good Topside Fillet Formation Dross Rate Equal or Lower Than Tin-Lead Solder Does Not Require a Nitrogen Atmosphere Does Not Erode Copper from Holes, Pads and Tracks Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface Also, Performs Well in Selective and Dip Soldering

The Best Choice for Lead-Free Wave Soldering SN100C is a lead-free solder alloy developed by Nihon Superior in Japan that is comprised of tin-copper-nickel + germanium. SN100C offers user-friendly properties and has been proven in commercial production since 1999. The result of these advantages is that SN100C offers high-throughput and the lowest cost of ownership as compared to any other lead-free solder alloy. Features:

  • Does Not Contain Silver or Bismuth
  • Eutectic Alloy
  • Bridge-Free and Icicle-Free Soldering
  • Smooth, Bright, Well-Formed Fillets, Free of Gross Micro-Cracks, Irrespective of the Cooling Rate
  • Good Through-Hole Penetration
  • Good Topside Fillet Formation
  • Dross Rate Equal or Lower Than Tin-Lead Solder
  • Does Not Require a Nitrogen Atmosphere
  • Does Not Erode Copper from Holes, Pads and Tracks
  • Low Rate of Copper Leaching Makes It Easy to Control the Copper Content of the Solder Bath
  • Lower Aggressiveness to Stainless Steel and Other Solder Pot Materials as Compared to Tin-Silver-Copper Alloys
  • Thermal Fatigue Resistance and Creep Strength Better Than Tin-Lead
  • Slow, Even Growth of the Intermetallic Layer at the Solder/Substrate Interface
  • Also, Performs Well in Selective and Dip Soldering
Supplier's Site

Technical Specifications

  Allied Electronics, Inc.
Product Category Filler Alloys and Consumables
Product Number 70054283
Product Name WS482 3% WATER SOLUABLE CORE SOLDER, SN100C, .032
Joining Process / Product Form Solid wire or rod
Unlock Full Specs
to access all available technical data

Similar Products

Printed Circuit Board (PCB) Solder Stencils - ALPHA ® CUT HR2 Laser Cut Stencils - MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
View Details
Solder - 555200 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0138 inch (0.3500 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Tin-Silver Alloy Solder (Sn-Ag)
View Details
Aluminum TIG Rod -  - Detroit Torch & Mfg. Co.
Detroit Torch & Mfg. Co.
Specs
Joining Process / Product Form Rod
Welding Filler Types Aluminum
Weld Positions All positions
View Details
Mild Alloy - Universal 70S-6 - Universal Wire Works Inc.
Universal Wire Works Inc.
Specs
Joining Process / Product Form MIG Spool (GMAW)
Diameter / Thickness 0.0230 to 0.1250 inch (0.5842 to 3.17 mm)
Nominal Composition .09C-1.6Mn-.015P-.02S-.95Si
View Details