ECS Inc. International Through Hole Crystals UM-1

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Datasheet
Datasheet Summary
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The UM-1 is a through-hole quartz crystal designed for compact communication equipment, operating in fundamental mode from 10.000 to 30.000 MHz or in third overtone from 25.000 to 90.000 MHz. It features a maximum shunt capacitance of 7 pF, a maximum drive level of 500 μW, and an AT-cut crystal. The operating temperature range extends from -40 to +85°C, with frequency tolerances and temperature coefficients defined in standardized tables. The package is a low-profile through-hole design, and the part is RoHS compliant.

Datasheet Summary
Powered by GS/AI

The UM-1 is a through-hole quartz crystal designed for compact communication equipment, operating in fundamental mode from 10.000 to 30.000 MHz or in third overtone from 25.000 to 90.000 MHz. It features a maximum shunt capacitance of 7 pF, a maximum drive level of 500 μW, and an AT-cut crystal. The operating temperature range extends from -40 to +85°C, with frequency tolerances and temperature coefficients defined in standardized tables. The package is a low-profile through-hole design, and the part is RoHS compliant.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - UM-1 - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
UM-1
Through Hole Crystals UM-1
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet

Technical Specifications

  ECS Inc. International
Product Category Crystals
Product Number UM-1
Product Name Through Hole Crystals
Package / Form Factor Through Hole Crystals
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