ECS Inc. International Through Hole Crystals ECS-60-32-4XDN

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Datasheet
Datasheet Summary
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The ECS-60-32-4XDN is a quartz crystal in the HC-49USX-DN series, designed for industrial temperature range applications from -40°C to +85°C. It features an industry-standard through-hole footprint and is RoHS compliant. The part operates at 6.000 MHz with a load capacitance of 32 pF, a maximum equivalent series resistance of 100 Ω in fundamental mode, and a drive level of 500 μW. Frequency tolerance is ±30 ppm at +25°C, and frequency stability over temperature is ±100 ppm. Shunt capacitance is 7 pF, and aging is ±5 ppm over the first year. Storage temperature ranges from -55°C to +125°C. The solder profile supports peak temperatures up to 260°C for 10 seconds, with MSL 1 and matte Sn/Cu lead finish.

Datasheet Summary
Powered by GS/AI

The ECS-60-32-4XDN is a quartz crystal in the HC-49USX-DN series, designed for industrial temperature range applications from -40°C to +85°C. It features an industry-standard through-hole footprint and is RoHS compliant. The part operates at 6.000 MHz with a load capacitance of 32 pF, a maximum equivalent series resistance of 100 Ω in fundamental mode, and a drive level of 500 μW. Frequency tolerance is ±30 ppm at +25°C, and frequency stability over temperature is ±100 ppm. Shunt capacitance is 7 pF, and aging is ±5 ppm over the first year. Storage temperature ranges from -55°C to +125°C. The solder profile supports peak temperatures up to 260°C for 10 seconds, with MSL 1 and matte Sn/Cu lead finish.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-60-32-4XDN - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-60-32-4XDN
Through Hole Crystals ECS-60-32-4XDN
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet
Crystals - X1113-ND - DigiKey
Thief River Falls, MN, United States
Crystals
X1113-ND
Crystals X1113-ND
6MHz ±30ppm Crystal 32pF 100 Ohms HC-49/US

6MHz ±30ppm Crystal 32pF 100 Ohms HC-49/US

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Technical Specifications

  ECS Inc. International DigiKey
Product Category Crystals Crystals
Product Number ECS-60-32-4XDN X1113-ND
Product Name Through Hole Crystals Crystals
Package / Form Factor Through Hole Crystals Through Hole; HC-49/US
Features / Standards RoHS Lead-Free
Frequency 6 MHz
Frequency Stability 100 ppm 100 ppm
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