The ECS-3X9X is a miniature quartz crystal designed for high-frequency applications, operating from 4.00 to 70.00 MHz with a load capacitance of 16 pF typ. It features a 3x9 mm package, operates over a temperature range of -10 to +60°C, and maintains frequency stability of ±50 ppm within that range. The device supports fundamental mode up to 30.00 MHz and third overtone operation above 30.00 MHz, with ESR values of 50 Ω max for 10.00-30.00 MHz and 80 Ω max for 36.00-70.00 MHz. Drive level is rated at 50-100 μW, and insulation resistance exceeds 500 MΩ at 100 V DC. Aging over the first year is ±5 ppm max at +25°C. The component is RoHS compliant, with a reflow solder profile peak temperature of +260°C for 10 seconds maximum and MSL 1 rating.
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.
Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.
Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
| ECS Inc. International | |
|---|---|
| Product Category | Crystals |
| Product Number | ECS-3X9X |
| Product Name | Through Hole Crystals |
| Package / Form Factor | Through Hole Crystals |
