ECS Inc. International Through Hole Crystals ECS-2X6X

Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Description
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.
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Datasheet
Datasheet Summary
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ECS-2X6X is a 32.768 kHz tuning fork crystal used as a clock source in communication equipment, measuring instruments, and microprocessors. It comes in a 2x6 mm through-hole package, operates from -10 to +60°C, and has a load capacitance of 12.5 pF, frequency tolerance of ±20 ppm, and maximum drive level of 1 μW. The series is RoHS compliant, with an insulation resistance of at least 500 MΩ at 100 V DC, aging of ±3 ppm max. over the first year, and shock resistance of ±5 ppm after three drops from 75 cm. Its solder profile allows peak temperatures up to 260°C for 10 seconds, with a maximum of two cycles and MSL 1.

Datasheet Summary
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ECS-2X6X is a 32.768 kHz tuning fork crystal used as a clock source in communication equipment, measuring instruments, and microprocessors. It comes in a 2x6 mm through-hole package, operates from -10 to +60°C, and has a load capacitance of 12.5 pF, frequency tolerance of ±20 ppm, and maximum drive level of 1 μW. The series is RoHS compliant, with an insulation resistance of at least 500 MΩ at 100 V DC, aging of ±3 ppm max. over the first year, and shock resistance of ±5 ppm after three drops from 75 cm. Its solder profile allows peak temperatures up to 260°C for 10 seconds, with a maximum of two cycles and MSL 1.

Suppliers

Company
Product
Description
Supplier Links
Through Hole Crystals - ECS-2X6X - ECS Inc. International
Lenexa, KS, United States
Through Hole Crystals
ECS-2X6X
Through Hole Crystals ECS-2X6X
Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications. Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors. Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Despite the rise in popularity of surface mount technology (SMT) in passive components, through hole packaging has remained an industry staple for eight decades for a reason. The simplicity and efficacy of this technology, along with its ability to be incorporated into a vast array of designs, make it an excellent choice for many different applications.

Crystals with through hole packing are ideal for larger components that will undergo a significant amount of mechanical stress, high voltage, and/or high power. This is because through hole soldering results in a stronger bond between the passive components and the circuit board. Example applications include transformers, connectors, semiconductors and electrolytic capacitors.

Other advantages to using through hole-mounted components include the compact design to decrease the component’s footprint on the circuit board, exceptional shock and vibration resistance, low frequencies and options for industrial temperature ranges and excellent aging and component longevity and durability.

Supplier's Site Datasheet

Technical Specifications

  ECS Inc. International
Product Category Crystals
Product Number ECS-2X6X
Product Name Through Hole Crystals
Package / Form Factor Through Hole Crystals
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