Dow DOWSIL™ EE-3200 Low Stress Silicone Encapsulant is a two component, low viscosity encapsulant with a 1:1 mix ratio, good heat dissipation, and good thermal conductivity. Once thoroughly mixed, the mixture will cure to a flexible elastomer for the protection of electronic and electrical components. Part B, 0.5 kg Jar.
| Ellsworth Adhesives | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | EE-3200 PART B .5KG |
| Product Name | Dow DOWSIL™ EE-3200 Silicone Encapsulant Part B Black 0.5 kg Jar |
| Cure / Technology | Two Component |
| Chemical System | Silicone |
| Industry | Automotive; Electronics |
| Thermal Conductivity | 0.5000 W/m-K (0.2889 BTU-ft/hr-ft²-F) |
