Dow Chemical Company (The) Heat Sink Compound, Tube, 100G; Dispensing Method Dow 340

Description

HEAT SINK COMPOUND, TUBE, 100G; Dispensing Method:Tube; Volume:-; Weight:100g; Product Range:- RoHS Compliant: Yes

Newark, An Avnet Company

Description

HEAT SINK COMPOUND, TUBE, 100G; Dispensing Method:Tube; Volume:-; Weight:100g; Product Range:- RoHS Compliant: Yes

Suppliers

Company

Product

Description

Supplier Links

Newark, An Avnet Company

Chicago, IL, United States

Heat Sink Compound, Tube, 100G; Dispensing Method Dow
00Z1757

Heat Sink Compound, Tube, 100G; Dispensing Method Dow 00Z1757

HEAT SINK COMPOUND, TUBE, 100G; Dispensing Method:Tube; Volume:-; Weight:100g; Product Range:- RoHS Compliant: Yes

Supplier's Site

Technical Specifications

	Newark, An Avnet Company
Product Category	Thermal Compounds and Thermal Interface Materials
Product Number	00Z1757
Product Name	Heat Sink Compound, Tube, 100G; Dispensing Method Dow

Unlock Full Specs

to access all available technical data

Similar Products

Hernon Manufacturing, Inc.

Formulations - Applications - Thermally Conductive - DISSIPATOR 745D

745D

Specs

Cure / Technology Room Temperature Vulcanizing or Curing

Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial

View Details

CHT USA Inc.

1-Part, Thermally Conductive, Space-Grade Silicone Adhesive, UL Listed

AS1707

Specs

Cure / Technology Single Component; Alkoxy

Chemical System Silicone

Industry Automotive; Electronics

View Details

Quantaflex Printed Electronics Inc.

Thermal Interface Materials

Specs

Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket

Industry Electronics; Semiconductors, IC's

Features EMI/RFI Shielding

View Details

Fujipoly® America Corp.

Thin Film, High Thermal Conductivity

SARCON ® HR

Specs

Form / Shape Gap Filler, Foam in Place Gasket

Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)

Industry Electronics; Semiconductors, IC's

View Details