Dongguan Sheen Electronic Technology Co., Ltd. PCM phase change material for communications equipment and wireless stations SP350P

Description
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring efficient heat transfer. ◆ Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ◆ Self-adhesive for easy application and rework. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPU/GPU Chips ◆ Capacitors ◆ Memory/VRAM particles ◆ Control boards ◆ Splitters ◆ Relays
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Description
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring efficient heat transfer. ◆ Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ◆ Self-adhesive for easy application and rework. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPU/GPU Chips ◆ Capacitors ◆ Memory/VRAM particles ◆ Control boards ◆ Splitters ◆ Relays
Request a Quote

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PCM phase change material for communications equipment and wireless stations - SP350P - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan, China
PCM phase change material for communications equipment and wireless stations
SP350P
PCM phase change material for communications equipment and wireless stations SP350P
The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K. ◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring efficient heat transfer. ◆ Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste. ◆ Self-adhesive for easy application and rework. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPU/GPU Chips ◆ Capacitors ◆ Memory/VRAM particles ◆ Control boards ◆ Splitters ◆ Relays

The SHEEN's SP Series Phase Change Thermal Pads are renowned for their distinctive characteristics, which include:
◆ Good thermal conductivity, with options ranging from 1.8 to 6.0 W/m·K.
◆ Low thermal impedance, reaching as low as 0.015 ℃*in²/W at 50psi, ensuring efficient heat transfer.
◆ Excellent wetting properties ensure that there is no risk of spillage after thermal cycling, making them a viable alternative to thermal grease/thermal paste.
◆ Self-adhesive for easy application and rework.
◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards.

【Applications】

◆ CPU/GPU Chips
◆ Capacitors
◆ Memory/VRAM particles
◆ Control boards
◆ Splitters
◆ Relays

Supplier's Site

Technical Specifications

  Dongguan Sheen Electronic Technology Co., Ltd.
Product Category Industrial Adhesives
Product Number SP350P
Product Name PCM phase change material for communications equipment and wireless stations
Features Thermally Conductive
Industry Electronics
Use Temperature -40 to 257 F (-40 to 125 C)
Thermal Conductivity 1.8 W/m-K (1.04 BTU-ft/hr-ft²-F)
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