Dongguan Sheen Electronic Technology Co., Ltd. High thermal conductivity carbon fiber heat sink soft thermal pad thermal gap filler for electronic devices CSF30

CSF series Carbon Fiber Thermal Pads are renowned for their distinctive characteristics, which include: ◆ Exceptional thermal conductivity options ranging from 15 to 45 W/mK. ◆ Available in various thicknesses from 0.3 to 12.0 mm. ◆ Features natural tackiness for easy application and rework. ◆ High compressibility, softness, and elasticity suitable for low-pressure applications. ◆ Low silicone oil bleed. ◆ Customizable shapes per client requirements. ◆ Compliant with RoHS, Halogen, REACH environmental and safety standards. ◆ Excellent flexibility, resilience, and thermal stability. 【Applications】 ◆ 5G Base Station RRU ◆ Chips ◆ Capacitors ◆ Memory/Graphics Memory Particles ◆ Hard Drives ◆ Control Boards ◆ Shunts ◆ Relays