Distrelec Group AG Thermal Pads WK 247

Description
Heat conducting disc 0.2mm TO-247
Request a Quote
Description
Heat conducting disc 0.2mm TO-247
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Thermal Pads - 2835256 - RS Components, Ltd.
Corby, Northants, United Kingdom
Thermal Pads
2835256
Thermal Pads 2835256
Heat conducting disc 0.2mm TO-247

Heat conducting disc 0.2mm TO-247

Supplier's Site

Technical Specifications

  RS Components, Ltd.
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 2835256
Product Name Thermal Pads
Use Temperature -76 to 356 F (-60 to 180 C)
Unlock Full Specs
to access all available technical data

Similar Products

Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound - SARCON ® SPG-20B - Fujipoly® America Corp.
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Thermally Conductive, Dimensionally Stable Epoxy - EP30AN - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  
Form / Shape Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details