Distrelec Group AG Thermal Pads WK 247

Description
Heat conducting disc 0.2mm TO-247
  • Thermal Pads - 2835256 - RS Components, Ltd.
    RS Components, Ltd.
Request a Quote
Description
Heat conducting disc 0.2mm TO-247
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Thermal Pads - 2835256 - RS Components, Ltd.
RS Components, Ltd.
Corby, Northants, United Kingdom
Thermal Pads
2835256
Thermal Pads 2835256
Heat conducting disc 0.2mm TO-247

Heat conducting disc 0.2mm TO-247

Supplier's Site

Technical Specifications

  RS Components, Ltd.
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 2835256
Product Name Thermal Pads
Use Temperature -76 to 356 F (-60 to 180 C)
Unlock Full Specs
to access all available technical data

Similar Products

MacDermid Alpha Electronics Solutions
Panel Level Packaging Metallization Solutions
PackageBond
Specs
Industry Electronics; Semiconductors, IC's
View Details
Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Two-component insulation thermal conductive gel for PCB - SE800AB - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Two-component insulation thermal conductive gel for PCB
SE800AB
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Extremely Compressible Thermal Gap Filler - SARCON® PG45A - Fujipoly® America Corp.
Fujipoly® America Corp.
Extremely Compressible Thermal Gap Filler
SARCON® PG45A
Specs
Form / Shape Putty; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0591 to 0.0984 inch (1.5 to 2.5 mm)
View Details