Data Delay Devices, Inc. Monolithic Manchester Encoder/Decoder Combo Chip 3D7503

Description
FEATURES • All-silicon, low-power CMOS technology • Encoder and decoder function independently • Encoder has buffered clock output • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Maximum data rate: 50 MBaud • Data rate range: ±15% • Lock-in time: 1 bit
Datasheet
Description
FEATURES • All-silicon, low-power CMOS technology • Encoder and decoder function independently • Encoder has buffered clock output • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Maximum data rate: 50 MBaud • Data rate range: ±15% • Lock-in time: 1 bit
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Monolithic Manchester Encoder/Decoder Combo Chip - 3D7503 - Data Delay Devices, Inc.
Clifton, NJ, USA
Monolithic Manchester Encoder/Decoder Combo Chip
3D7503
Monolithic Manchester Encoder/Decoder Combo Chip 3D7503
FEATURES • All-silicon, low-power CMOS technology • Encoder and decoder function independently • Encoder has buffered clock output • TTL/CMOS compatible inputs and outputs • Vapor phase, IR and wave solderable • Auto-insertable (DIP pkg.) • Low ground bounce noise • Maximum data rate: 50 MBaud • Data rate range: ±15% • Lock-in time: 1 bit

FEATURES
• All-silicon, low-power CMOS technology
• Encoder and decoder function independently
• Encoder has buffered clock output
• TTL/CMOS compatible inputs and outputs
• Vapor phase, IR and wave solderable
• Auto-insertable (DIP pkg.)
• Low ground bounce noise
• Maximum data rate: 50 MBaud
• Data rate range: ±15%
• Lock-in time: 1 bit

Datasheet

Technical Specifications

  Data Delay Devices, Inc.
Product Category Logic Decoders and Demultiplexers
Product Number 3D7503
Product Name Monolithic Manchester Encoder/Decoder Combo Chip
Function Decoder
Supply Voltage 1.2V; 1.5V; 1.8V; 2.5V; 3V; 3.3V; 3.6V; 5V; -0.3V to 7V
Package Type SOIC (optional feature); DIP (optional feature)
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