American Electronic Components, Inc. Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool DTP1

Description
THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool - 15AC9760 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool
15AC9760
Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool 15AC9760
THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes

THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 15AC9760
Product Name Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool
Unlock Full Specs
to access all available technical data

Similar Products

Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Thermal Pads - 606953 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 9 W/m-K (5.2 BTU-ft/hr-ft²-F)
View Details
Two Component Epoxy Resin System - Supreme 11AOHTLP - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Grease, Paste
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details