American Electronic Components, Inc. Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool DTP1

Description
THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool - 15AC9760 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool
15AC9760
Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool 15AC9760
THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes

THERMAL PAD, 44.5X57.2MM, 0.127MM; Thickness:0.127mm; Conductive Material:-; Thermal Conductivity:-; Thermal Impedance:0.48°C/W; Volume Resistivity:-; External Length:44.5mm; External Width:57.2mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 15AC9760
Product Name Thermal Pad, 44.5X57.2Mm, 0.127Mm; Thickness Durakool
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Heat Transfer Compound - T-3 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Use Temperature 32 to 850 F (0 to 454 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Electrolube ® ER2220 Highly Thermally Conductive Epoxy Potting Compound -  - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details