The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through numerical control.
Our edge grinders are attracting attention as requirements become more stringent for precision and processing quality of wafer edge and circumference. They are also attracting attention as the measures for knife edge to improve the yield in the device process.
We provide solutions for various requirements from customers and challenges with our edge grinders.
●Applicable to 12-inch wafers
●1 or 2 grinding stage (s)
●4 cassettes as standard (Options available)
●High precision beveling with forming grinding wheels inheriting the conventional numerically controlled grinding
●Applicable to mass production system such as primary beveling of Si wafers
●Capable of connecting to network for factory automation
| Daitron Co., Ltd. | |
|---|---|
| Product Category | Wafer and Thin Film Instrumentation |
| Product Number | WBM-3000 Series |
| Product Name | Wafer Edge Grinders |
| Form Factor | Monitor or instrument |
