IEC 62047-16:2015 specifies the test methods to measure the residual stresses of films with thickness in the range of 0,01 µ to 10 µ in MEMS structures fabricated by wafer curvature or cantilever beam deflection methods.
| CSA Group | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | IEC 62047-16:2015 |
| Product Name | Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods |
