Our ultra-flat ceramic vacuum wafer chucks, stepper chucks, porous chucks, and electrostatic chucks improve yield management for semiconductor wafer processing. Low-surface-contact configurations minimize the risk of back-side particles for sensitive applications. Our wafer chucks provide:
Ultra-flat capabilities
Mirror polish
Exceptional light weight
High stiffness
Low thermal expansion
φ 300 mm diameter and beyond
Extreme wear resistance
Our ultra-flat ceramic vacuum wafer chucks, stepper chucks, porous chucks, and electrostatic chucks improve yield management for semiconductor wafer processing. Low-surface-contact configurations minimize the risk of back-side particles for sensitive applications. Our wafer chucks provide:
- Ultra-flat capabilities
- Mirror polish
- Exceptional light weight
- High stiffness
- Low thermal expansion
- Φ 300 mm diameter and beyond
- Extreme wear resistance
