CHT's QSil 553 is a 2-part, platinum cure, silicone potting compound and encapsulant designed to protect electronic components from harsh environmental conditions and shock and vibration. It features a low viscosity for convenient dispensing and will easily flow throughout components. Because of its low modulus, QSil 553 will minimize cooefficient of thermal expansion (CTE) strain. QSil 553 is thermally conductive to aid in efficient heat dissipation. This silicone elastomer is also flame retardant and is UL Listed in file QMFZ2.E205830.
| CHT USA Inc. | |
|---|---|
| Product Category | Encapsulants and Potting Compounds |
| Product Number | QSil-553 |
| Product Name | 2-Part, Thermally Conductive Silicone Potting Compound and Encapsulant, UL Listed |
| Industry | Automotive; Electronics; OEM or Industrial |
| Viscosity | 6000 cP |
| Type | Thermally Conductive |
| Use Temperature | -67 to 464 F (-55 to 240 C) |
| Dielectric Strength | 600 kV/in (236 kV/cm) |
