Chip Quik, Inc. Solder RASWLF.020 1OZ

Description
Lead Free Rosin Activated (RA) Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)
Request a Quote Datasheet
Description
Lead Free Rosin Activated (RA) Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - RASWLF.0201OZ-ND - DigiKey
Thief River Falls, MN, United States
Lead Free Rosin Activated (RA) Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)

Lead Free Rosin Activated (RA) Wire Solder Sn96.5Ag3Cu0.5 (96.5/3/0.5) 24 AWG, 25 SWG Spool, 1 oz (28.35g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number RASWLF.0201OZ-ND
Product Name Solder
Joining Process / Product Form Solid wire or rod; Spool, 1 oz (28.35g)
Unlock Full Specs
to access all available technical data

Similar Products

Solder Thermal Interface Materials (TIMs) for High Performance - Kester ® Indium sTIM - MacDermid Alpha Electronics Solutions
Specs
Solder Alloy Indium Alloy Solders
View Details
Solder - 7568881 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0500 inch (1.27 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Aluminum Brazing Compound - FL-7® - Esprix Technologies
Specs
Nominal Composition Tetrafluoro Potassium Aluminate (KAlF4); Pentafluoro Potassium Monohydrate (K2AlF5 · H20)
Braze Alloy Aluminum Alloy Braze
View Details
Non-Precious Brazing Filler Gemco® -  - Morgan Advanced Materials
Specs
Joining Process / Product Form Powder (optional feature); Strip, sheet or foil (optional feature); Solid wire or rod (optional feature)
Melting Range 1616 to 1787 F (880 to 975 C)
View Details