MacDermid Alpha Electronics Solutions Semiconductor Solder Flux for Packaging ALPHA ® WS-698 Flux

Description
Product Overview ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Copper (ENIG) pad finishes. ALPHA WS-698 is a halogen-free, compliant material with high fluxing activity, delivering performance advantages in wetting, spread, and missing ball rate/yield. Product Features Excellent Soldering Excellent activity enables strong soldering to ENIG and Cu OSP finishes. Wetting Performance Superior wetting maximizes assembly yields, providing the highest ball attach and flip chip yield rates. Cleaning Strength Excellent cleanability, with residues easily removed using deionized water. Featured Applications Pin Transfer Precision Application: The flux’s high activity and stable viscosity ensure precise, consistent application, crucial for accurate pin transfer. Flip Chip / Ball Dip Material Stability: Maintains tack and viscosity across multiple print cycles, ensuring consistent performance without frequent replenishment. Printing Using ALPHA® WS-698 Flux in printing applications ensures high-quality, reliable solder joints, which are vital for semiconductor performance and longevity.
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Description
Product Overview ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Copper (ENIG) pad finishes. ALPHA WS-698 is a halogen-free, compliant material with high fluxing activity, delivering performance advantages in wetting, spread, and missing ball rate/yield. Product Features Excellent Soldering Excellent activity enables strong soldering to ENIG and Cu OSP finishes. Wetting Performance Superior wetting maximizes assembly yields, providing the highest ball attach and flip chip yield rates. Cleaning Strength Excellent cleanability, with residues easily removed using deionized water. Featured Applications Pin Transfer Precision Application: The flux’s high activity and stable viscosity ensure precise, consistent application, crucial for accurate pin transfer. Flip Chip / Ball Dip Material Stability: Maintains tack and viscosity across multiple print cycles, ensuring consistent performance without frequent replenishment. Printing Using ALPHA® WS-698 Flux in printing applications ensures high-quality, reliable solder joints, which are vital for semiconductor performance and longevity.
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Datasheet
Datasheet Summary
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ALPHA WS-698 Paste Flux is a water-soluble, halogen-free flux designed for soldering lead-free and tin-lead eutectic alloys onto area array packages such as BGA, CSP, and Flip Chip. It is supplied in 150g cartridges and 30g syringes, with a viscosity of 250 to 550 Poise at 10rpm and a tack strength exceeding 140 gF. It meets IPC-J-STD-004 ORH0 activity level, passes copper corrosion and SIR tests (≥1.9×10¹⁰ Ω at 85 °C/85% RH), and is cleaned effectively with deionized water at 55-60 °C. Recommended for use in nitrogen atmospheres with ≤100 ppm oxygen, and stored at 15-25 °C with a 6-month shelf life.

Datasheet Summary
Powered by GS/AI

ALPHA WS-698 Paste Flux is a water-soluble, halogen-free flux designed for soldering lead-free and tin-lead eutectic alloys onto area array packages such as BGA, CSP, and Flip Chip. It is supplied in 150g cartridges and 30g syringes, with a viscosity of 250 to 550 Poise at 10rpm and a tack strength exceeding 140 gF. It meets IPC-J-STD-004 ORH0 activity level, passes copper corrosion and SIR tests (≥1.9×10¹⁰ Ω at 85 °C/85% RH), and is cleaned effectively with deionized water at 55-60 °C. Recommended for use in nitrogen atmospheres with ≤100 ppm oxygen, and stored at 15-25 °C with a 6-month shelf life.

Suppliers

Company
Product
Description
Supplier Links
Semiconductor Solder Flux for Packaging - ALPHA ® WS-698 Flux - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Semiconductor Solder Flux for Packaging
ALPHA ® WS-698 Flux
Semiconductor Solder Flux for Packaging ALPHA ® WS-698 Flux
Product Overview ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Copper (ENIG) pad finishes. ALPHA WS-698 is a halogen-free, compliant material with high fluxing activity, delivering performance advantages in wetting, spread, and missing ball rate/yield. Product Features Excellent Soldering Excellent activity enables strong soldering to ENIG and Cu OSP finishes. Wetting Performance Superior wetting maximizes assembly yields, providing the highest ball attach and flip chip yield rates. Cleaning Strength Excellent cleanability, with residues easily removed using deionized water. Featured Applications Pin Transfer Precision Application: The flux’s high activity and stable viscosity ensure precise, consistent application, crucial for accurate pin transfer. Flip Chip / Ball Dip Material Stability: Maintains tack and viscosity across multiple print cycles, ensuring consistent performance without frequent replenishment. Printing Using ALPHA® WS-698 Flux in printing applications ensures high-quality, reliable solder joints, which are vital for semiconductor performance and longevity.

Product Overview

ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Copper (ENIG) pad finishes. ALPHA WS-698 is a halogen-free, compliant material with high fluxing activity, delivering performance advantages in wetting, spread, and missing ball rate/yield.

Product Features

Excellent Soldering

Excellent activity enables strong soldering to ENIG and Cu OSP finishes.


Wetting Performance

Superior wetting maximizes assembly yields, providing the highest ball attach and flip chip yield rates.


Cleaning Strength

Excellent cleanability, with residues easily removed using deionized water.

Featured Applications

Pin Transfer

Precision Application: The flux’s high activity and stable viscosity ensure precise, consistent application, crucial for accurate pin transfer.


Flip Chip / Ball Dip

Material Stability: Maintains tack and viscosity across multiple print cycles, ensuring consistent performance without frequent replenishment.


Printing

Using ALPHA® WS-698 Flux in printing applications ensures high-quality, reliable solder joints, which are vital for semiconductor performance and longevity.

Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Filler Alloys and Consumables
Product Number ALPHA ® WS-698 Flux
Product Name Semiconductor Solder Flux for Packaging
Solder Alloy Tin-Lead Alloy Solder (SN-Pb); Lead Free
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