MacDermid Alpha Electronics Solutions Semiconductor Solder Flux for Packaging ALPHA ® WS-698 Flux

Product Overview ALPHA WS-698 water-soluble flux is engineered for soldering a variety of lead-free and tin-lead eutectic alloys onto area array packages. The flux is highly compatible with Copper Organic Solderability Preservative (Cu-OSP), electrolytic Nickel-Gold (Ni-Au), and Electroless Nickel/Immersion Copper (ENIG) pad finishes. ALPHA WS-698 is a halogen-free, compliant material with high fluxing activity, delivering performance advantages in wetting, spread, and missing ball rate/yield. Product Features Excellent Soldering Excellent activity enables strong soldering to ENIG and Cu OSP finishes. Wetting Performance Superior wetting maximizes assembly yields, providing the highest ball attach and flip chip yield rates. Cleaning Strength Excellent cleanability, with residues easily removed using deionized water. Featured Applications Pin Transfer Precision Application: The flux’s high activity and stable viscosity ensure precise, consistent application, crucial for accurate pin transfer. Flip Chip / Ball Dip Material Stability: Maintains tack and viscosity across multiple print cycles, ensuring consistent performance without frequent replenishment. Printing Using ALPHA® WS-698 Flux in printing applications ensures high-quality, reliable solder joints, which are vital for semiconductor performance and longevity.