Chip Quik, Inc. Solder NC191LT50T5

Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
Request a Quote Datasheet
Description
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Solder - 315-NC191LT50T5-ND - DigiKey
Thief River Falls, MN, United States
Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 1.76 oz (50g)

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Filler Alloys and Consumables
Product Number 315-NC191LT50T5-ND
Product Name Solder
Joining Process / Product Form Braze or solder in the form of a paste.; Jar, 1.76 oz (50g)
Unlock Full Specs
to access all available technical data

Similar Products

Solder - 1796683 - RS Components, Ltd.
RS Components, Ltd.
Specs
Joining Process / Product Form Solid wire or rod; Wire
Diameter / Thickness 0.0787 inch (2 mm)
Solder Alloy Tin-Lead Alloy Solder (SN-Pb)
View Details
Cored Solder Wire for Electronics - ALPHA ® Telecore Plus Cored Wire - MacDermid Alpha Electronics Solutions
Specs
Joining Process / Product Form Flux Cored Wire
View Details
Solder Pastes - LOCTITE HF 250DP - Henkel Corporation - Industrial
Henkel Corporation - Industrial
Specs
Joining Process / Product Form Braze or solder in the form of a paste.
View Details