Chip Quik, Inc. Solder NC191LT250

Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

DigiKey

Request a Quote

Email Supplier

Datasheet

Description

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

DigiKey

Thief River Falls, MN, United States

Solder
315-NC191LT250-ND

Solder 315-NC191LT250-ND

Lead Free No-Clean Solder Paste Bi57.6Sn42Ag0.4 (57.6/42/0.4) Jar, 8.8 oz (250g)

Buy Now

Datasheet

Technical Specifications

	DigiKey
Product Category	Filler Alloys and Consumables
Product Number	315-NC191LT250-ND
Product Name	Solder
Joining Process / Product Form	Braze or solder in the form of a paste.; Jar, 8.8 oz (250g)

Unlock Full Specs

to access all available technical data

Similar Products

RS Components, Ltd.

Solder

1796668

Specs

Joining Process / Product Form Solid wire or rod; Wire

Diameter / Thickness 0.0197 inch (0.5000 mm)

Solder Alloy Tin-Lead Alloy Solder (SN-Pb)

View Details

MacDermid Alpha Electronics Solutions

Low and No-Silver Lead Free Alloys

Specs

Solder Alloy Lead Free

View Details

Sunstone Engineering

Nickel Pre-Cut Tabs

Specs

Joining Process / Product Form Filler braze or solder alloy in a reconfigured sheet form that fits the contour of the joint surfaces.

Welding Filler Types Nickel Alloy

View Details

Lincoln Electric Co. (The)

Welding Consumable - Hardfacing

Lincore® 40-S

Specs

Applications / Materials Joined Idlers,Drive Sprockets, Mine Car Wheels

Joining Process / Product Form Metal-cored Submerged Arc (SAW) Electrode

Diameter / Thickness 0.1250 inch (3.17 mm)

View Details