MacDermid Alpha Electronics Solutions Solder Paste Materials for Printed Circuit Boards (PCB) ALPHA ® OM-565 HRL3 Solder Paste

Product Overview ALPHA OM-565 HRL3 low-temperature solder paste is designed to mitigate warpage induced defects in temperature-sensitiv e chip-scale packages. This solder paste enables peak reflow temperatures of 175°C and offers superior wettability to minimize post-reflow defects, such as Non-Wet-Open (NWO) and Head-In-Pillow (HiP). The ALPHA OM-565 chemistry enhances electrochemical performance compared to existing low-melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications. Product Features Compatibility with HRL3 Alloy Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability. Enables Peak Reflow Temperature of 175°C The HRL3 alloy enables a peak reflow temperature of 175°C, effectively mitigating warpage induced defects. Low Melt Point Reflow Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process. Superior HiP/NWO Performance Compatibility with Contact Rework Applications 8-Hour Stencil Life in Ambient and Elevated Conditions