Celanese Corporation HOSTAFORM C 9021 10/9005 2729

Description
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul
Description
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul

Suppliers

Company
Product
Description
Supplier Links
HOSTAFORM C 9021 10/9005 - 2729 - Celanese Corporation
Irving, TX, USA
HOSTAFORM C 9021 10/9005
2729
HOSTAFORM C 9021 10/9005 2729
It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul

It is normally not necessary to dry HOSTAFORM. However, should there be surface moisture (condensate) on the molding compound as a result of incorrect storage, drying is required. A circulating air drying cabinet can be used for this purpose if the granul

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2729
Product Name HOSTAFORM C 9021 10/9005
Type ExtrusionGrade; MoldingCompound; Thermoplastic
Chemical System Acetal or Polyoxymethylene (POM)
Filler Unfilled
Unlock Full Specs
to access all available technical data

Similar Products

ELAN-Cast® - E 43-5701 Gray Resin / C 402 Hardener - ELANTAS North America LLC
Specs
Type CastingResin; Thermally cured
Form / Shape Liquid
Chemical System Epoxy
View Details
ACETAL (DELRIN) BLACK PELLETS - 900P (2 LBS) - APSX, LLC
Specs
Type MoldingCompound; Thermoplastic
Form / Shape Pellets
Chemical System Acetal or Polyoxymethylene (POM)
View Details
Ducoya® Electrically Conductive Polyimide for Semiconductors - G202 C - Duvelco Limited
Specs
Type Thermoplastic
Form / Shape Pellets
Chemical System Polyimide or Bismaleimide (BMI)
View Details
Epoxy  Has Low Thermal Expansion Coefficient - EP30LTE-LO - Master Bond, Inc.
Specs
Type CastingResin; Optical; Thermally cured
Form / Shape Liquid
Chemical System Epoxy
View Details