Celanese Corporation HOSTAFORM S 9364 XAP2 ™ 2659

Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is suggested to help achieve low emission performance and to counter if material has contacted moisture through improper storage and handling.
Description
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is suggested to help achieve low emission performance and to counter if material has contacted moisture through improper storage and handling.

Suppliers

Company
Product
Description
Supplier Links
HOSTAFORM S 9364 XAP2 ™ - 2659 - Celanese Corporation
Irving, TX, USA
HOSTAFORM S 9364 XAP2 ™
2659
HOSTAFORM S 9364 XAP2 ™ 2659
Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is suggested to help achieve low emission performance and to counter if material has contacted moisture through improper storage and handling.

Do not heat over 205 C (~400 F) to avoid burning and discoloring product.. Drying is suggested to help achieve low emission performance and to counter if material has contacted moisture through improper storage and handling.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 2659
Product Name HOSTAFORM S 9364 XAP2 ™
Type ExtrusionGrade; MoldingCompound; Thermoplastic
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