Celanese Corporation CELANEX 7316 26

Description
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40°F (-40°C) at 250°F (121°C) for 4 hours.
Description
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40°F (-40°C) at 250°F (121°C) for 4 hours.

Suppliers

Company
Product
Description
Supplier Links
CELANEX 7316 - 26 - Celanese Corporation
Irving, TX, USA
CELANEX 7316
26
CELANEX 7316 26
To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40°F (-40°C) at 250°F (121°C) for 4 hours.

To avoid hydrolytic degradation during processing, CELANEX resins have to be dried to a moisture level equal to or less than 0.02%. Drying should be done in a dehumidifying hopper dryer capable of dewpoints <-40°F (-40°C) at 250°F (121°C) for 4 hours.

Supplier's Site

Technical Specifications

  Celanese Corporation
Product Category Polymers and Plastic Resins
Product Number 26
Product Name CELANEX 7316
Type MoldingCompound; Thermoplastic
Filler Unfilled
Features UL
Use Temperature 248 to 266 F (120 to 130 C)
Deflection Temperature 383 F (195 C)
Unlock Full Specs
to access all available technical data

Similar Products

ELAN-Volt® -  - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type Thermoplastic
Chemical System Epoxy; Thermoplastic Polyester (PET, PBT, etc.); Polyetherimide
Industry Aerospace; Electrical Power or High Voltage
View Details
THERMOPLASTIC ELASTOMER (TPE) BLACK PELLETS - G7980 (2 LBS) - APSX, LLC
Specs
Type MoldingCompound; Thermoplastic
Form / Shape Pellets
Chemical System Polyethylene
View Details
Ducoya® Electrostatic Dissipative Polyimide for Semiconductors - G201 ESD - Duvelco Limited
Specs
Type Thermoplastic
Form / Shape Pellets
Chemical System Polyimide or Bismaleimide (BMI)
View Details
NASA Low Outgassing Approved Epoxy System - EP30LTE - Master Bond, Inc.
Specs
Type CastingResin; Optical; Thermally cured
Form / Shape Liquid
Chemical System Epoxy
View Details