1629 -- HOSTAFORM C 9021 10/1570
Celanese Corporation
HOSTAFORM C 9021 10/1570
1629
Description
Polymer Resin
Description
Polymer Resin
Suppliers
HOSTAFORM C 9021 10/1570
1629
Supplier's Site
Technical Specifications
|
Product Category
|
Polymers and Plastic Resins |
|
Product Number
|
1629 |
|
Product Name
|
HOSTAFORM C 9021 10/1570 |
|
Type
|
MoldingCompound; Thermoplastic
|
Unlock Full Specs
to access all available technical data
Similar Products
Type
Thermoplastic
Form / Shape
Pellets
Chemical System
Polyimide or Bismaleimide (BMI)
View Details
Dexmet® Corporation, a part of PPG’s engineered materials division
Type
CastingResin; Thermally cured
Chemical System
Epoxy; Silicone
Features
EMI / RFI Shielding Material
View Details
Mitsui Chemicals America, Inc.
Type
Thermoplastic
Chemical System
Polyimide or Bismaleimide (BMI)
View Details
Type
CastingResin; Thermally cured
Chemical System
Epoxy
Filler
Metal or MIM
View Details
