Broadcom Inc. Subminiature High Performance TS AlInGaP Red LED Lamps HLMT-PG00-P0000

Description
Flat Top Package The HLMT-PG00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications. Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps datasheet. Technology These subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies the transparent substrate carrier technology (TS = HLMT-Devices). The TS HLMT-Devices are especially effective in very bright ambient lighting conditions.
Description
Flat Top Package The HLMT-PG00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications. Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps datasheet. Technology These subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies the transparent substrate carrier technology (TS = HLMT-Devices). The TS HLMT-Devices are especially effective in very bright ambient lighting conditions.

Suppliers

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Subminiature High Performance TS AlInGaP Red LED Lamps - HLMT-PG00-P0000 - Broadcom Inc.
San Jose, CA, USA
Subminiature High Performance TS AlInGaP Red LED Lamps
HLMT-PG00-P0000
Subminiature High Performance TS AlInGaP Red LED Lamps HLMT-PG00-P0000
Flat Top Package The HLMT-PG00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications. Lead Configurations All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps datasheet. Technology These subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies the transparent substrate carrier technology (TS = HLMT-Devices). The TS HLMT-Devices are especially effective in very bright ambient lighting conditions.

Flat Top Package
The HLMT-PG00 flat top lamps use an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is necessary for use in backlighting applications. The flat top lamps are also ideal for use as emitters in light pipe applications.

Lead Configurations
All of these devices are made by encapsulating LED chips on axial lead frames to form molded epoxy subminiature lamp packages. A variety of package configuration options is available. These include special surface mount lead configurations, gull wing, yoke lead, or Z-bend. Right angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm (0.200 inch) center spacing are available for through hole mounting. For more information refer to Standard SMT and Through Hole Lead Bend Options for Subminiature LED Lamps datasheet.

Technology
These subminiature solid state lamps utilize the newly developed aluminum indium gallium phosphide (AlInGaP) LED technologies the transparent substrate carrier technology (TS = HLMT-Devices). The TS HLMT-Devices are especially effective in very bright ambient lighting conditions.

Supplier's Site

Technical Specifications

  Broadcom Inc.
Product Category Light Emitting Diodes (LED)
Product Number HLMT-PG00-P0000
Product Name Subminiature High Performance TS AlInGaP Red LED Lamps
LED Package: 1.65mm
LED Type Red
Peak Wavelength 626 nm (6260 Å)
Viewing Angle 125 degrees
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