Boyd Pads, Sheets, Bridges SOFTFLEX-E038-10-02-0762-0762

Description
Thermal Pad Gray 76.20mm x 76.20mm Square Adhesive - Both Sides
Request a Quote Datasheet
Description
Thermal Pad Gray 76.20mm x 76.20mm Square Adhesive - Both Sides
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Pads, Sheets, Bridges - HS433-ND - DigiKey
Thief River Falls, MN, United States
Pads, Sheets, Bridges
HS433-ND
Pads, Sheets, Bridges HS433-ND
Thermal Pad Gray 76.20mm x 76.20mm Square Adhesive - Both Sides

Thermal Pad Gray 76.20mm x 76.20mm Square Adhesive - Both Sides

Buy Now Datasheet

Technical Specifications

  DigiKey
Product Category Leveling and Filling Compounds
Product Number HS433-ND
Product Name Pads, Sheets, Bridges
Thermal Conductivity 3.8 W/m-K (2.2 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Redistribution Layer for Wafer Level Packaging - NOVAFAB ® VIA FILL AU - MacDermid Alpha Electronics Solutions
Specs
Industry Electronics
View Details
Fillers & Putties - 4479719 - RS Components, Ltd.
RS Components, Ltd.
Specs
Type / Form Liquid
Features Sealant
Use Temperature 122 F (50 C)
View Details
Underfill Epoxy Offers Thermal Conductivity And Electrical Insulation - EP29LPTCHT - Master Bond, Inc.
Specs
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Chemical System Epoxy
Type / Form Liquid
View Details
LOCTITE ECCOBOND UF 1173, Epoxy, 2nd Level Underfill - LOCTITE ECCOBOND UF 1173 - Henkel Adhesive Technologies - Aviation, Space and Rail
Henkel Adhesive Technologies - Aviation, Space and Rail
Specs
Cure / Technology Thermoset
Chemical System Epoxy
Features Adhesive
View Details