Boyd Pads, Sheets, Bridges SOFTFLEX-C022-30-01-4000-2000

Description

Thermal Pad Gray-Pink 400.00mm x 200.00mm Rectangular Adhesive - One Side

DigiKey

Request a Quote

Email Supplier

Datasheet

Description

Thermal Pad Gray-Pink 400.00mm x 200.00mm Rectangular Adhesive - One Side

Request a Quote

Email Supplier

Datasheet

Suppliers

Company

Product

Description

Supplier Links

DigiKey

Thief River Falls, MN, United States

Pads, Sheets, Bridges
HS466-ND

Pads, Sheets, Bridges HS466-ND

Thermal Pad Gray-Pink 400.00mm x 200.00mm Rectangular Adhesive - One Side

Buy Now

Datasheet

Technical Specifications

	DigiKey
Product Category	Leveling and Filling Compounds
Product Number	HS466-ND
Product Name	Pads, Sheets, Bridges
Thermal Conductivity	2.2 W/m-K (1.27 BTU-ft/hr-ft²-F)

Unlock Full Specs

to access all available technical data

Similar Products

RS Components, Ltd.

Fillers & Putties

4479719

Specs

Type / Form Liquid

Features Sealant

Use Temperature 122 F (50 C)

View Details

MacDermid Alpha Electronics Solutions

Liquid Gap Fillers for Electronics

Electrolube ® LGF200 Liquid Gap Filler

Specs

Cure / Technology Two Component

Type / Form Liquid

Features Electrically Conductive; Sealant

View Details

Master Bond, Inc.

High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial

EP70CN

Specs

Cure / Technology Thermoset; Two Component ; Room Temperature Vulcanizing or Curing

Chemical System Epoxy

Composition Unfilled

View Details

Shenzhen DeepMaterial Technologies Co., Ltd

Underfill Epoxy

DM-6310

Specs

Cure / Technology Heat curing

Chemical System Epoxy

Industry Electronics

View Details